Navigating Challenges At The Leading Edge Of Test Technology
نویسنده
چکیده
Keynote: The Future of Power Electronics and the Impending Challenges to Metrology Thomas Neyer Fellow, High-Voltage Device and Technology Development, Fairchild Semiconductor Power electronics has successfully established its foothold in most domestic, industrial and automotive applications like power supplies, household machines, air conditioners, power generation and transmission units, all type of electrical motors and automotive drives and pumps. In addition, the power devices have increased their conduction and switching inefficiencies by a multitude by utilizing novel device architectures, novel materials or extreme current densities enabled by ultra-thin wafer technology or narrow mesa trench technology. Testing these devices for function, conformity with datasheet, and reliability stretches the test requirements significantly, particularly on wafer level. High-voltage (> 1 kV), high-current (> 150 A) and extreme switching speeds sometimes present considerable challenges. In this paper the author will present trends for silicon and wide-bandgap power devices, and will walk through some of the issues industry encounters when characterizing and testing these advanced power switches and passives. 2015
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